Abstract:
Most electronic components are based on
monocrystalline silicon, with only a small percentage of them
made of polycrystalline and amorphous silicon. Micromechanical
components such as acceleration sensors in car safety systems and
micro-fluidic circuits are also made of monocrystalline silicon. The
machining of complex shapes from hard and brittle materials such
as monocrystalline silicon still remains a critical area of research.
This paper explores the current status of research and
developments in micromachining of silicon. Special focus is
paid on the cutting methods employed in slicing and dicing of
the silicon. Areas of concern that call for further research and
development in micromachining of silicon are also discussed. It is
expected that this paper will expose the challenging issues of silicon
micromaching and wafer slicing and dicing, and also stimulate
research interests in this area.
