Abstract:
Monocrystalline silicon is an important material for the manufacture of MEMS and
MOEMS devices. Formation of microcracks and extensive heat a ected zones are
major challenges associated with laser micromachining. In recent times, lasers have
gained popularity in micromachining applications. This trend has been due to the
various unique properties that lasers possess. These properties include the ease of
manipulation, and the ability to focus the beam to a small spot.
In this research, e ects of the Nd:YAG laser beam and process parameters on cut quality
attributes of monocrystalline silicon were investigated. The parameters investigated
were: scan speed, power and beam spot diameter. The quality attributes investigated
were kerf depth, and thermal stress e ects such as microcracks formation. A numerical
model was developed using nite element analysis method to investigate the parameters
and attributes.
The results of the study show that increasing the laser scan speed led to a decrease
in the kerf depth and a decrease in microcracks formation. Also, increasing the spot
diameter of the beam led to a decrease in kerf depth and a decrease in the microcracks
formation. Increasing the laser power led to an increase in kerf depth, and an increase
in microcracks formation. The simulation results were validated by comparison to
experimental ones. The models satisfactorily predicted the expected kerf depth and
microcrack formation for the laser parameters studied.
